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Maaike M Visser Taklo

Sjefforsker

Maaike M Visser Taklo

Sjefforsker

Maaike M Visser Taklo
Telefon: +47 930 59 334
Mobil: +47 930 59 334
Avdeling: Smart Sensor Systems
Kontorsted: Oslo

Publikasjoner og ansvarsområder

Publikasjoner

Publikasjon

Hygrothermal aging of flip-chip assembled MOEMS

http://www.sintef.no/publikasjoner/publikasjon/?pubid=CRIStin+1458002

A flip-chip version of an optical MEMS (MOEMS) assembly is demonstrated in this work. A dummy MOEMS device is attached directly onto a traditional FR-4 board using a novel isotropic conductive adhesive (ICA) in order to minimize both fabrication costs and footprint of the assembly. The assembly solu...

Forfattere Taklo Maaike M Visser Wright Daniel Nilsen Kolberg Sigbjørn Vardøy Astrid-Sofie Hamou Faycal Riad Vogl Andreas Bakke Thor Kristiansen Helge Kalland Erik
År 2017
Type Presentasjon
Publikasjon

Smart Tags that are exactly Reliable Enough

http://www.sintef.no/publikasjoner/publikasjon/?pubid=CRIStin+1450852

Smart tags for fast moving consumer goods are among the products predicted to be part of the Internet of Everything. The tags must be extremely low cost, be fabricated in huge volumes, and have a quality accepted by the end user. Screening tests have been performed to evaluate technologies for hybri...

Forfattere Taklo Maaike M Visser Belle Branson Wright Daniel Nilsen Vardøy Astrid-Sofie Garcia Alexandre Eriksson Torbjörn Hagel Olle Danestig Magnus
År 2017
Type Konferanseartikkel/Bokkapittel
Publikasjon

Al-Al Wafer-Level Thermocompression Bonding applied for MEMS

http://www.sintef.no/publikasjoner/publikasjon/?pubid=CRIStin+1479512

Wafer-level thermocompression bonding (TCB) using aluminum (Al) is presented as a hermetic sealing method for MEMS. The process is a CMOS compatible alternative to TCB using metals like gold (Au) and copper (Cu), which are problematic with respect to cross contamination in labs. Au and Cu are common...

År 2017
Type Konferanseartikkel/Bokkapittel
Publikasjon

Soldering of components onto a smart tag - an evaluation of the process window

http://www.sintef.no/publikasjoner/publikasjon/?pubid=CRIStin+1479622

An experiment was designed using optimal design of experiments to identify the most relevant parameters in an assembly step for a smart tag; the soldering of 0402 resistors to a polyimide backplane. The parameter window was set to reflect natural variations in production, and parameter variations we...

Forfattere Vardøy Astrid-Sofie Garcia Alexandre Wright Daniel Nilsen Belle Branson Taklo Maaike M Visser Hagel Olle Xie Li Danestig Magnus Eriksson Torbjörn
År 2017
Type Presentasjon
Publikasjon

Texture of Al films for wafer-level thermocompression bonding

http://www.sintef.no/publikasjoner/publikasjon/?pubid=CRIStin+1462979

Properties of aluminum thin films for thermocompression bonding have been studied in terms of surface roughness, grain size, and grain orientation by AFM, SEM, XRD and EBSD for thermocompression bonding. Al films were sputter deposited directly on Si and thermally oxidized Si wafers, respectively. T...

Forfattere Malik Nishant Venkatachalapathy Vishnukanthan Dall Wilhelm Schjølberg-Henriksen Kari Poppe Erik Taklo Maaike M Visser Finstad Terje
År 2017
Type Tidsskriftsartikkel
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