More publications
- Wafer bonding process for zero level vacuum packaging of MEMS Read publication
- Metal Films for MEMS Pressure Sensors: Comparison of Al, Ti, Al-Ti Alloy and Al/Ti Film Stacks Read publication
- Al-Al Wafer-Level Thermocompression Bonding applied for MEMS Read publication
- Texture of Al films for wafer-level thermocompression bonding Read publication
- Environmental Stress Testing of Wafer-Level Al-Al Thermocompression Bonds: Strength and Hermeticity Read publication
- Environmental Stress Testing of Wafer-Level Au-Au Thermocompression Bonds Realized at Low Temperature: Strength and Hermeticity Read publication
- Impact of SiO2 on Al–Al thermocompression wafer bonding Read publication
- Conductivity of high-temperature annealed silicon direct wafer bonds Read publication
- Hermeticity and Reliability of Au-Au Thermocompression Bonds, Realized at Low Temperature
- Wafer-level Au–Au bonding in the 350–450 ◦C temperature range Read publication
Other
- Metal films for MEMS pressure sensors: comparison of Al, Ti, Al-Ti alloy and Al/Ti film stacks
- Al-Al Wafer-Level Thermocompression Bonding applied for MEMS
- Plastic Deformation of Thin Si Membranes in Si-Si Direct Bonding
- Grain structure of Aluminium films for wafer-level thermocompression bonding
- Hermeticity and Reliability of Au-Au Thermocompression Bonds, Realized at Low Temperature
- Hermeticity and Reliability of Al-Al Thermocompression Wafer Bonding
- ANALYSIS OF RESIDUAL STRESS AND THERMAL HYSTERESIS IN SPUTTERED ALUMINIUM THIN FILMS
- Low-temperature bonding technologies for MEMS and 3D-IC
- Hermeticity and reliability characterization of Al-Al thermocompression bonding
- Bond strength of conductive Si-Si fusion bonded seals
