Characterization of hermetic wafer-level Cu-Sn SLID bonding
Category
Academic chapter/article/Conference paper
Language
English
Author(s)
- Hubertus Johannes van de Wiel
- Astrid-Sofie Vardøy
- Gregory Hayes
- Hartmut Fischer
- Adriana Lapadatu
- Maaike Margrete Visser Taklo
Affiliation
- Netherlands Organisation for Applied Scientific Research
- SINTEF Digital / Smart Sensors and Microsystems
- SensoNor ASA
Year
2012Publisher
IEEE conference proceedings
Book
4th Electronics System-Integration Technology Conference (ESTC 2012)
ISBN
978-1-4673-4645-0
