High temperature reliability of aluminium wire-bonds to thin film, thick film and low temperature co-fired ceramic (LTCC) substrate metallization
Category
Academic article
Language
English
Author(s)
- Rolf Johannessen
- Frøydis Oldervoll
- Frode Strisland
Affiliation
- SINTEF Digital / Smart Sensors and Microsystems
Year
2008Published in
Microelectronics and reliability
ISSN
0026-2714
Volume
48
Issue
10
Page(s)
1711 - 1719
