Wafer-level Au-Au thermocompression bonding for hermetic device sealing
Category
Academic lecture
Client
- Research Council of Norway (RCN) / 210601
Language
English
Author(s)
- Hannah Rosquist Tofteberg
- Kari Schjølberg-Henriksen
- Eivind Johan Fasting
- Alexander Stene Moen
- Maaike Margrete Visser Taklo
- Erik Poppe
- Christian Julius Simensen
Affiliation
- SINTEF Digital / Smart Sensors and Microsystems
- OsloMet - Oslo Metropolitan University
- SINTEF Industry / Sustainable Energy Technology
Presented at
Micromechanics Europe
Place
Espoo
Date
01.09.2013 - 04.09.2013
