Void formation and bond strength investigated for wafer-level Cu-Sn SLID bonding
Category
Academic lecture
Language
English
Author(s)
- Astrid-Sofie Vardøy
- H. J. van de Wiel
- Stian Martinsen
- G. Hayes
- H. Fischer
- Knut E. Aasmundtveit
- Adriana Lapadatu
- Maaike Margrete Visser Taklo
Affiliation
- SINTEF Digital / Smart Sensors and Microsystems
- Netherlands Organisation for Applied Scientific Research
- SensoNor ASA
- University of South-Eastern Norway
Presented at
46th International symposium on microelectronics, IMAPS 2013
Place
Orlando, Florida
Date
30.09.2013 - 03.10.2013
Organizer
IMAPS
