Bond strength of conductive Si-Si bonded seals
Category
Academic chapter/article/Conference paper
Client
- Research Council of Norway (RCN) / 210601
Language
English
Author(s)
- Kari Schjølberg-Henriksen
- Lars Geir Whist Tvedt
- Sigurd Moe
- Erik Poppe
- Dag Thorstein Wang
- Stein Are Gjelstad
- Christopher Mørk
- Kristin Imenes
Affiliation
- SINTEF Digital / Smart Sensors and Microsystems
- University of South-Eastern Norway
Year
2014Publisher
EDA Publishing Association
Book
Symposium on Design, test, Integration & Packaging of MEMS/MOEMS, Cannes, France, 1-4 April, 2014
ISBN
9782355000287
Page(s)
312 - 317
