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Anisotropic study of thermal stresses induced by diameter fluctuation during Czochralski silicon single crystal growth

Abstract

Instabilities in the Czochralski crystal growth process result in deviation from the desired crystal diameter i.e. uneven crystal surface. The excessive thermoelastic stress induced by diameter perturbation is studied by mean of numerical simulations. A set of 3D simulation has been performed for an axisymmetric crystal. The crystal anisotropy is taken into account. The influence of crystal diameter fluctuation on stress field inside the crystal has been studied. The resolved shear stresses have been calculated for 12 slip systems for three crystal orientations. Accumulated excess stress from its critical value is calculated. Simulation results suggest that crystal surface undulation affects both thermal field and stress distribution inside the crystal. The crystal region with high risk of dislocation generation is discussed for three crystal orientation. The stress level in [1 1 1] crystal orientation is found to be lower than other orientations.

Category

Academic article

Language

English

Author(s)

Affiliation

  • Norwegian University of Science and Technology
  • SINTEF Industry / Metal Production and Processing

Year

2014

Published in

Journal of Crystal Growth

ISSN

0022-0248

Publisher

Elsevier

Volume

400

Page(s)

1 - 6

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