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Immobilization of metal coated polymer spheres on Indium pads

Abstract

This paper investigates an approach for creating a metallurgic bond between Ø5 μm metal (Au)-coated polymer spheres (MPS) and Indium (In) pads. MPS were positioned onto In pads where the metal coating reacted with the In. The MPS were deposited by dry dispensing. The adhesion force between the MPS and the In pads was measured by acceleration/centrifugal testing. Under a centrifugal force of 34 nN, the percentage of remaining MPS increased from 10 % for samples without heat treatment to more than 90 % for samples exposed to 200 °C annealing. This is a strong indication that a metallurgic bond had formed between the metal coating on the MPS and the In on the pads.

Category

Academic chapter

Language

English

Author(s)

  • Vinh Duy Cao
  • Hoang-Vu Nguyen
  • Helge Kristiansen
  • Maaike Margrete Visser Taklo
  • Knut Eilif Aasmundtveit
  • Nils Hoivik

Affiliation

  • SINTEF Digital / Smart Sensors and Microsystems
  • University of South-Eastern Norway
  • Conpart AS

Year

2014

Publisher

IEEE (Institute of Electrical and Electronics Engineers)

Book

Electronics System-Integration Technology Conference (ESTC), 2014, Helsinki. 16-18 Sept. 2014

ISBN

9781479940257

View this publication at Norwegian Research Information Repository