Thermomechanical reliability of gold stud bump bonding for large volume MEMS devices
Category
Academic lecture
Client
- EU / HYPERCONNECT FP7-NMP-310420
- EU / HyperConnect FP7-NMP-310420
Language
English
Author(s)
- Maaike Margrete Visser Taklo
- Daniel Nilsen Wright
- Astrid-Sofie Vardøy
- Alastair Attard
- Zlatko Hajdarevic
- Stephan Bulacher
- Mario Saliba
- Jan Wijgaerts
- Joshua Borg
- David Oscar Vella
Affiliation
- SINTEF Digital / Smart Sensors and Microsystems
- Austria
- Belgium
- Malta
Presented at
Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th
Place
San Jose
Date
26.05.2015 - 29.05.2015
Organizer
IEEE
