Nanoparticle assembly and sintering towards all-copper flip chip interconnects
Category
Academic lecture
Language
English
Author(s)
- Jonas Zürcher
- Kerry Yu
- Gerd Schlottig
- Mario Baum
- Maaike Margrete Visser Taklo
- Bernhard Wunderle
- Piotr Warszynski
- Thomas Brunschwiler
Affiliation
- Switzerland
- United Kingdom
- Germany
- SINTEF Digital / Smart Sensors and Microsystems
- Jerzy Haber Institute of Catalysis and Surface Chemistry Polish Academy of Sciences
Presented at
Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th
Place
San Jose
Date
26.05.2015 - 29.05.2015
Organizer
IEEE
