Abstract
Poster på postersesjon
Development of cost-effective high-density through-wafer interconnects for 3D microsystems
Category
Academic lecture
Language
English
Author(s)
Affiliation
- SINTEF Digital / Smart Sensors and Microsystems
Presented at
16th European Workshop on Micromechanics (MME 2005)
Place
Göteborg, Sweden
Date
04.09.2005 - 06.09.2005
