To main content

A mixed-signal BiCMOS Front-End Signal Processor for High-Temperature Applications

Abstract

A mixed-signal ASIC that implements an ultrasound front-end receiver in a 0.6 m BiCMOS HotASIC technology that features metal/metal capacitors and poly1/poly2 resistors is described. The ASIC includes a low-noise amplifier (LNA), a programmable gain amplifier (PGA), an output differential amplifier (ODA), and a second-order sigma-delta modulator (SDM), and is the most compact system for high-temperature ultrasound applications reported in literature. The circuit has a programmable gain and is designed for measuring the signal response (200 kHz to 700 kHz) from an ultrasound transducer. At 48 MHz clockfrequency and 200 C, the power consumption is 85 mW from a single 5 V supply. The die area of the chip is 5.52 mm2.

Category

Academic article

Language

English

Author(s)

Affiliation

  • SINTEF Digital / Sustainable Communication Technologies
  • SINTEF Digital / Smart Sensors and Microsystems
  • Diverse norske bedrifter og organisasjoner
  • France

Year

2006

Published in

IEEE Journal of Solid-State Circuits

ISSN

0018-9200

Publisher

IEEE (Institute of Electrical and Electronics Engineers)

Volume

41

Issue

7

Page(s)

1638 - 1647

View this publication at Cristin