3D Detector Activities at SINTEF MiNaLab – Wafer Bonding, and Deep Reactive Ion Etching
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Category
Academic lecture
Language
English
Author(s)
Affiliation
- SINTEF Digital / Smart Sensors and Microsystems
Presented at
International Wafers Level Packaging Conference
Place
San Jose
Date
13.10.2008 - 16.10.2008
Organizer
SMTA
