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All-Cu interconnects by sintered nano copper paste

Category

Academic lecture

Language

English

Author(s)

Affiliation

  • SINTEF Digital / Smart Sensors and Microsystems
  • Unknown

Presented at

IMAPS Nordic - International Microelectronics And Packaging Society - Nordic Chapter

Place

Tønsberg

Date

05.06.2016 - 07.06.2016

Organizer

IMAPS

Year

2016

View this publication at Cristin