All-Copper Flip Chip Interconnects by Pressure-less and Low Temperature Nanoparticle Sintering
Category
Academic lecture
Language
English
Author(s)
- Jonas Zürcher
- Luca Del Carro
- Gerd Schlottig
- Daniel Nilsen Wright
- Astrid-Sofie Vardøy
- Maaike Margrete Visser Taklo
- Tobias Mills
- Uwe Zschenderlein
- Bernhard Wunderle
- Thomas Brunschwiler
Affiliation
- Unknown
- SINTEF Digital / Smart Sensors and Microsystems
Presented at
The 66th Electronic Components and Technology Conference - ECTC
Place
Las Vegas, NV
Date
31.05.2016 - 03.06.2016
Organizer
IEEE
