Comparison of hermetic sealing using SAC and SnPb solder for a MEMS pressure sensor
Category
Academic lecture
Language
English
Author(s)
- Maaike Margrete Visser Taklo
- Branson Belle
- Joachim Seland Graff
- Astrid-Sofie Vardøy
- Elisabeth Grønn Ramsdal
Affiliation
- SINTEF Digital / Smart Sensors and Microsystems
- Unknown
- SINTEF Industry / Sustainable Energy Technology
- University of Oslo
Presented at
12th International Conference and Exhibition on Device Packaging
Place
Scottsdale
Date
15.03.2016 - 17.03.2016
Organizer
IMAPS
