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Simultaneous improvement of surface finish and bonding of centrifugal microfluidic devices in cyclo-olefin polymers

Abstract

Two key issues in the manufacturing of microfluidic devices are to obtain low surface roughness, i.e. in the range of nanometers (to facilitate optical detection and controlled flow through microfluidic networks), and to achieve robust bonding. Here we report that a chemical polishing step, used for smoothening the surface of cyclo-olefin polymer (COP) components manufactured by micromilling, reduces the surface roughness (to Ra ∼ 150 nm) and facilitates a leak-tight COP-COP bond. We report new results on COP structuring and surface characterization by white light interferometry (WLI), infrared spectroscopy (FTIR-ATR), contact angle measurements and transmittance measurements, as well as demonstrations of a functional thermally bonded centrifugal microfluidic devices
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Category

Academic chapter/article/Conference paper

Language

English

Affiliation

  • SINTEF Digital / Smart Sensors and Microsystems
  • SINTEF Industry / Materials and Nanotechnology
  • SINTEF Industry / Sustainable Energy Technology
  • SINTEF Industry / Process Technology

Year

2018

Publisher

IEEE (Institute of Electrical and Electronics Engineers)

Book

2018 IEEE Micro Electro Mechanical Systems (MEMS), 2018, Belfast UK, 21-25 Jan. 2018

ISBN

978-1-5386-4783-7

Page(s)

1257 - 1260

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