Capillary forces as a limiting factor for sawing of ultrathin silicon wafers by diamond multi-wire saw

Client

• EC/H2020 / 609788

Author(s)

• Birgit Ryningen
• Pål Tetlie
• Sverre Gullikstad Johnsen
• Halvor Dalaker

Affiliation

• SINTEF Industry / Sustainable Energy Technology
• Norwegian University of Science and Technology
• SINTEF Industry / Metal Production and Processing

Issue

5

DOI

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