UV-Nanoimprint and Deep Reactive Ion Etching of High Efficiency Silicon Metalenses: High Throughput at Low Cost with Excellent Resolution and Repeatability

Author(s)

• Christopher Andrew Dirdal
• Karolina Barbara Milenko-Kuszewska
• Anand Summanwar
• Firehun Tsige Dullo
• Paul Conrad Vaagen Thrane
• Oana Rasoga
• Andrei M. Avram
• Adrian Dinescu
• Angela M. Baracu

Affiliation

• SINTEF Digital / Smart Sensors and Microsystems
• National Institute of Materials Physics
• Romania

Issue

3

DOI