High strength die-attach for structural monitoring sensors
Category
Academic lecture
Client
- Research Council of Norway (RCN) / 295864
Language
English
Author(s)
- Astrid-Sofie Vardøy
- Hoang-Vu Nguyen
- Guido Sordo
- Lisette Hernandez Gonzalez
- Hjørtur Guttormsson
- André Larsen
Affiliation
- SINTEF Digital / Smart Sensors and Microsystems
- University of South-Eastern Norway
- Unknown
Presented at
2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac)
Place
Oslo
Date
12.06.2023 - 14.06.2023
Organizer
IMAPS Nordic
