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Investigation of Compliant Interconnect for Ball Grid Array (BGA)

Category

Academic chapter/article/Conference paper

Language

English

Author(s)

  • Rolf Johannessen
  • Frøydis Oldervoll
  • Helge Kristiansen
  • Hallvard Tyldum
  • Hoang-Vu Nguyen
  • Knut Eilif Aasmundtveit

Affiliation

  • SINTEF
  • Unknown
  • Norwegian University of Science and Technology
  • University of South-Eastern Norway

Year

2009

Publisher

International Microelekctroncis and Packaging Society Italian Chapter

Book

Microelectronics and Packaging Conference, 2009. EMPC 2009. European

ISBN

9781424447220

View this publication at Cristin