Abstract
The bond quality of anodically bonded wafers was studied after
reversing the current through the bonded interface. After a cathodic
process the bond quality decreased with increasing reverse current. The
degradation of the bond depended on the glass quality and on the
original bond. Pyrex no. 7740 and Hoya SD-2 glass wafers were tested.
reversing the current through the bonded interface. After a cathodic
process the bond quality decreased with increasing reverse current. The
degradation of the bond depended on the glass quality and on the
original bond. Pyrex no. 7740 and Hoya SD-2 glass wafers were tested.
