Capacitive micromachined ultrasonic transducers fabricated by advanced wafer bonding and RIE etch
Category
Academic chapter/article/Conference paper
Language
English
Author(s)
- Kjersti Midtbø
- Arne Rønnekleiv
- Dag T. Wang
Affiliation
- Norwegian University of Science and Technology
- SINTEF
Year
2006Publisher
Eurosensors
Book
Proceedings of the XX Eurosensors
ISBN
91-631-9281-0
Page(s)
T3B - O2
