Abstract
Here we present the design and modeling of a novel piezoresistive microphone designed for a photoacoustic gas sensor system. The microphone is fabricated using a novel process to enable DRIE etch through of membranes of multiple thickness.
A Clover shaped silicon piezoresistive microphone for miniaturized photoacoustic gas sensors
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Category
Academic chapter/article/Conference paper
Language
English
Author(s)
- Christopher Grinde
- Per Øhlckers
- Michal Marek Mielnik
- Geir Uri Jensen
- DT Wang
Affiliation
- University of South-Eastern Norway
- SINTEF Digital
Year
2009Publisher
EDA Publishing Association
Book
Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS, 2009. DTIP MEMS/MOEMS '09
Page(s)
256 - 260
