Au-Sn SLID bonding for high temperature applications
Category
Academic chapter/article/Conference paper
Language
English
Author(s)
- Torleif Andre Tollefsen
- Andreas Larsson
- Knut E. Aasmundtveit
Affiliation
- University of South-Eastern Norway
- SINTEF Digital / Smart Sensors and Microsystems
Year
2011Publisher
International Microelectronics and Packaging Society (IMAPS)
Book
Proceedings 2011 IMAPS International Conference on High Temperature Electronics Network (HiTEN 2011) : july 18-20, 2011, Oxford
ISBN
0-930815-93-9
Page(s)
58 - 67
