Wafer-level Bonding using Anisotropic Conductive Adhesive for 3D MEMS Applications
Category
Abstract
Language
English
Author(s)
- Lars Geir Whist Tvedt
- Nicolas Lietaer
- Thor Bakke
- Keith Redford
- Helge Kristiansen
Affiliation
- SINTEF Digital / Smart Sensors and Microsystems
- Conpart AS
Year
2012Published in
IMAPS 8th International Conference and Exhibition on Device Packaging, Proceedings
