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Compliant Interconnects for Reduced Cost of a Ceramic Ball Grid Array Carrier

Category

Poster

Language

English

Author(s)

  • Maaike Margrete Visser Taklo
  • Andreas Larsson
  • Astrid-Sofie Vardøy
  • Helge Kristiansen
  • Lars Hoff
  • Knut Waaler

Affiliation

  • SINTEF Digital / Smart Sensors and Microsystems
  • Conpart AS
  • University of South-Eastern Norway
  • WesternGeco

Presented at

Electronic Components and Technology Conference (ECTC), 2012 IEEE 62nd

Place

San Diego

Date

29.05.2012 - 01.06.2012

Organizer

IEEE

Year

2012

View this publication at Cristin