Reliable HT electronic packaging - Optimization of a Au-Sn SLID joint
Category
Academic lecture
Language
English
Author(s)
- Torleif Andre Tollefsen
- Maaike Margrete Visser Taklo
- Knut E. Aasmundtveit
- Andreas Larsson
Affiliation
- University of South-Eastern Norway
- Norwegian University of Science and Technology
- SINTEF Digital / Smart Sensors and Microsystems
Presented at
4th Electronics System Integration Technologies Conference
Place
Amsterdam
Date
17.09.2012 - 20.09.2012
Organizer
IEEE