High temperature bonding technology for SiC devices – Au-Sn SLID
Category
Academic lecture
Language
English
Author(s)
- Torleif Andre Tollefsen
- Andreas Larsson
- Knut E. Aasmundtveit
Affiliation
- University of South-Eastern Norway
- SINTEF Digital / Smart Sensors and Microsystems
Presented at
Berkeley Sensor and Actuator Center seminar
Place
Berkeley
Date
25.10.2011 - 25.10.2011
Organizer
University of California Berkeley
