Challenges Related to Underfill for European Activities on 3D Integration
Category
Academic lecture
Language
English
Author(s)
- Maaike Margrete Visser Taklo
Affiliation
- SINTEF Digital / Smart Sensors and Microsystems
Presented at
Underfill Challenges for 3D Interconnect
Place
San Jose
Date
09.11.2012 - 09.11.2012
Organizer
SEMATECH
