SINTEF (coordinator)

SINTEF is a multidisciplinary organisation structured into six business areas. The participating institute, Information and Communication Technology (ICT), is a centre for advanced and innovative research, development and advisory services in the fields of Microtechnology, Communication and software technology, Computational software, Information systems, Security and safety.

The Microsystems and Nanotechnology Department (MiNaLab, 35 people), part of the ICT institute, specialises in the design and fabrication of advanced sensors such as X-ray detectors, pressure sensors, accelerometers etc. Designs can be realised in a state of the art automated 150 mm silicon clean room fabrication facility or can be contracted out to a partner network that include the world’s main MEMS foundries. The group has a strong capability in finite element based modeling of mechanical, thermal, acoustical, electrical and other properties of sensor structures. In the area of microfabrication, the group’s strong points lie in bulk micomachining technology, bonding based packaging of sensor structures and design for manufacturing. The group has a proven track record in the successful completion of national as well as European projects such as: IST-2001-32411 MASCOT, where a MEMS based gas sensor has been developed and ESPRIT 28415 IPHITEMPS, where a MEMS based high temperature gas sensor was developed. In FP6, the institute is heavily involved in the IST program.

 

SINTEF has recently opened a state-of-the-art MEMS processing facility. With the Deep Reactive Ion Etching (DRIE) tool, an AMS200 I-speeder from Alcatel, high precision DRIE processes are available. The angle of side walls can be tuned, the smoothness of side walls can be adjusted, and the critical transition region between sidewalls and membranes can be optimised. Two different DRIE methods, BOSCH and CRYO, are available. Due to the inductively coupled plasma (ICP), etch uniformity as good as  2% has been achieved. Etch speed of 15 µm/min has been demonstrated.  A wide range of bonding methods is possible. The high process temperature (>1000C) used in the fusion bonding process is not always compatible with preceding process steps; thus, plasma assisted bonding at a reduced temperature (< 400C) is an option in this project. The plasma process can be optimized with regard to reduction of voids. For bonding methods involving the combination of different materials like silicon and glass, the Suss Microtec SB6e bonder offers the possibility of controlling both heating and cooling of the two wafers to be laminated separately. A controlled heating and cooling process is valuable for stress reduction in the bonded wafer stack. Patterning of resist on highly structured double-sided wafers is possible with the photolithography tools, two MA150e aligners and an ACS200 resist coater from SUSS MicroTec. Large exposure gap optics (LGO) enables the resist to be exposed even in grooves as deep as the wafer thickness. This will be highly useful in defining optimized solutions for membrane definition and stress minimization. Highly reliable metal systems suitable for harsh environments can be constructed with the wide range of metal combinations that are available. Metal systems suitable for bump bonding are also available.

 

Web-site: www.sintef.no

 

Memscap AS

MEMSCAP AS (Norway) is owned by the French MEMSCAP S.A. The business is focused on sensor- and transducer solutions, based on micro-electro-mechanical systems (MEMS) technology, for the Medical and the Aerospace industry.

MEMSCAP AS has a unique background in the Norwegian MEMS environment. The history of the company goes back to the early sixties were its initial technology platform were developed at SINTEF, Oslo. Through different foundations of MEMS companies, the business was a part of the Norwegian SensoNor ASA until 2002. MEMSCAP AS has today 35 employees with a revenue of MNOK 30,5 for the year 2003.

MEMSCAP AS has been operating in the Aerospace industry for about 20 years, with is high stability SP82 sensor in application areas like: Air Data Computers, Carbine Pressure and Engine Control. The customer base is concentrated both in the US- and the European Aerospace industry. The today’s piezoresistive pressure sensor has obtained design-in approval for a variety of aircrafts with the following reference list: Boeing 737, 747, 717, 757, SIKORSKY 576, Eurofighter 2000, McDonnell Douglas MD90, Airbus, Cessna Citation VII, Citation X and Ultra, McDonnell Douglas DC9, McDonnell Douglas, Harrier/AV8B, Nimrod, EH101, Augusta, Super Puma, Bell 412, Dassault Falcon 2000, Hawker Horizon, 800 XP, Lockheed C130, C141 & C5A. JSF, Tucano, Jetstream 31, Beech Airking, Gulfstream IV &V.

Web-site: www.memscap.com

Microelectronica S.A.

Founded in 1984 as a MOS technology I.C.'s producer, MICROELECTRONICA has extended its field of excellence developing optoelectronic devices, special applications, new materials and devices.

Microelectronica was established in 1984, in the manufacturing and research of MOS based technologies in the field of optoelectronic products – LED’s. The processing and manufacturing equipment was procured, from Western countries such as Germany, Swiss, England and the US starting in ’84 through the present time. Microelectronica was the main supplier of MOS chips to the former socialist common market –CAER-. Microelectronica was privatised by the government privatisation fund in the 1st quarter of 1999 by current owner JACLYN S.A, a Romanian company holding approximately 90% of the shares. The balance of shares is floated on the – RASDAQ, a Romanian counterpart to NASDAQ.

Web-site: www.microel.ro

Curtiss-Wright Controls (UK) Ltd.

Penny & Giles Aerospace, a part of Curtiss-Wright Controls (UK) Ltd. is a multidisciplinary organisation that designs, manufactures, repairs and supports avionics equipment, which incorporates electronics, software and mechanical elements.

Penny & Giles Aerospace employs around 80 people in Christchurch, UK with a turn over of around £10 million. The product range includes primary air data units, cockpit voice and flight data recorders, air data test sets, pitot-static leak testers, quick access recorders and ice & snow detection systems. Penny & Giles have a flexible, highly skilled and experienced design team.  The team is able to meet demanding requirements and time schedules with innovative designs.  The design team consists of 16 engineers skilled in high integrity electronic, software and mechanical design.

Penny & Giles' success in world markets results from innovative technology, creative designs, manufacturing excellence and interactive customer support.  Penny & Giles supply to most of the world’s aircraft manufacturers and operators on both fixed and rotary wing aircraft for both civil and military markets.

 

Penny & Giles was founded in 1955 out of a partnership between Professor William A Penny and Mr James A Giles, where they identified a demand for instrumentation in the aviation industry for high precision, high reliability wire-wound potentiometric devices for customers engaged in aircraft flight testing.  Developments in 1959 led to the first aircraft Accident Data Recorder based on magnetic recording of data on stainless steel wire (popularly known as the 'Black Box'). Through the following decades, Penny & Giles developed technologies and products for diverse markets such as professional broadcasting and recording, controllers for powered wheelchairs, paperless chart recorders and trackerballs for computer interfacing. Many of these autonomous business units have been divested during the last decade.

 

Penny & Giles is wholly owned by the Curtiss-Wright Corporation of Roseland, New Jersey. Curtiss-Wright is a diversified, global enterprise delivering highly engineered, technologically advanced, value-added products and services to a broad range of industries in the motion control, flow control and metal treatment market segments. The firm employs approximately 4,300 people.

 

Web-site: http://www.pennyandgiles.com

 

Ceramica Ingenua SRL

The company was established in September 2006 dedicated for ceramic composite materials and research activities in the field.

The main business area is manufacturing and design of ceramic structures with supervised porosity and bio-compatible ceramic materials for bone reconstruction. Other fields of expertise are:

• nanostructure materials, bio-compatible for medical devices;
• integrated technologies for the vitros SiO2  in obtaining composite ceramics;
• oxygen selective ceramics membranes for chemical processes of obtaining gas at high temperature;
• realization and confirmation of porous ceramic bounds for oxygenation of vestigial water in the purification station from urban conglomerates;
• functional semiconductor ceramics providing protection for casual supra-intensity and for the high temperature electrochemical membranes;
• semiconductor ceramics for ignition file SOFC of the high temperature electrochemical membranes
• ceramics based on lanthanum chromite;

The company has an established collaboration with the other Rominian partner, Microelectronica.