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Cracks, inclusions and microscopy of Si at SINTEF ICT

Abstract

The activity on optical inspection of silicon wafers at SINTEF ICT has a focus on micro crack detection and NIR microscopy. The Scanning Near Infra-Red Microscopy (SNIRM) configuration and experimental setup, as well as measurement results on microcracks and inclusions were presented. Short introduction to immersion optics with silicon lenses.

Category

Academic lecture

Language

English

Author(s)

Affiliation

  • SINTEF Digital / Smart Sensors and Microsystems

Presented at

Nordic workshop for mechanical issues for silicon wafers and cells

Place

Rosenholm

Date

25.11.2010 - 25.11.2010

Organizer

Zwick Norge & SINTEF MK

Year

2010

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