Miniature, low-cost, 200 mW, infrared thermal emitter sealed by wafer-level bonding
Category
Academic lecture
Client
- Research Council of Norway (RCN) / 247781
Language
English
Author(s)
- Kari Schjølberg-Henriksen
- Jo Gjessing
- Kari Anne Hestnes Bakke
- Sanja Hadzialic
- Dag Thorstein Wang
Affiliation
- SINTEF Digital / Smart Sensors and Microsystems
Presented at
Photonics West - OPTO
Place
San Fransisco
Date
27.01.2017 - 01.02.2017
Organizer
SPIE - International Society for Optics and Photonics
