Al-Al Wafer-Level Thermocompression Bonding applied for MEMS
Category
Academic lecture
Client
- Research Council of Norway (RCN) / 247781
- Research Council of Norway (RCN) / 210601
Language
English
Author(s)
- Maaike M. Visser Taklo
- Kari Schjølberg-Henriksen
- Nishant Malik
- Erik Poppe
- Sigurd Moe
- Terje Finstad
Affiliation
- SINTEF Digital / Smart Sensors and Microsystems
- University of Oslo
Presented at
5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2017)
Place
Tokyo
Date
16.05.2017 - 18.05.2017
Organizer
The Univeristy of Tokyo (IEEE CPMT Society, JSPS)
