'Spotting & Bonding' - A novel method for Multi stack, Wafer -level bonding of PiezoMEMS devices
Category
Poster
Language
English
Author(s)
Affiliation
- SINTEF Digital / Smart Sensors and Microsystems
Presented at
10th International Piezoelectric MEMS Workshop
Place
Aachen
Date
19.03.2024 - 19.06.2024
Organizer
aixACCT Systems