'Spotting & Bonding' - A novel method for Multi stack, Wafer -level bonding of PiezoMEMS devices
Category
Poster
Language
English
Author(s)
Affiliation
- SINTEF Digital / Smart Sensors and Microsystems
Presented at
Nordic Nanolab User Meeting (NNUM 2024)
Place
Oslo
Date
03.06.2024 - 04.06.2024
Organizer
NorFab