To main content

Clamping Pressure Behavior of Pressboard under Thermal Cycling: Experimental and Numerical results

Abstract

High-density pressboard samples are compressed to a constant dimension in a steel rig, and then subjected to thermal cycling. Clamping pressure and temperature are measured over several days. Temperature measurements are used as input for a simple numerical spring model to recreate the elastic behavior of the pressboard. The experimental results show that samples deform much less when pre-compressed (sized). The spring model shows great promise to further understand the long-term mechanical behavior of pressboard.

Category

Academic article

Client

  • Research Council of Norway (RCN) / 319289

Language

English

Affiliation

  • SINTEF Energy Research / Elkraftteknologi

Year

2024

Published in

Proceedings of the International Colloquium Transformer Research and Asset Management

ISSN

1849-210X

Volume

6

View this publication at Cristin