Wafer-bonded CMUTs with through-wafer electrical vias design for immersed applications
Category
Academic lecture
Language
English
Author(s)
- Kjersti Midtbø
- Arne Rønnekleiv
- Jon Due-Hansen
- Erik Poppe
- Dag Thorstein Wang
- Geir Uri Jensen
Affiliation
- Norwegian University of Science and Technology
- SINTEF Digital / Smart Sensors and Microsystems
- SINTEF Digital
Presented at
9TH INTERNATIONAL WORKSHOP ON MICROMACHINED ULTRASONIC TRANSDUCERS
Place
Panevezys
Date
20.05.2010 - 21.05.2010
Organizer
Minatech and PMC (Panevezys Centre of Mechatronics)
